3

Defect detection of flip-chip solder joints using modal analysis

Year:
2012
Language:
english
File:
PDF, 1.97 MB
english, 2012
6

Suspended integration of pyrolytic carbon membrane on C-MEMS

Year:
2015
Language:
english
File:
PDF, 976 KB
english, 2015
42

Effects of preexisting voids on electromigration failure of flip chip solder bumps

Year:
2001
Language:
english
File:
PDF, 323 KB
english, 2001